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Principal Module Reliability Engineer

  • Location

    Birmingham

  • Sector:

    Automotive

  • Job type:

    Permanent

  • Salary:

    £53.7k per year

  • Contact:

    Tim Parkes

  • Contact email:

    tim.parkes@jonlee.co.uk

  • Contact phone:

    01384 446145

  • Job ref:

    53908

Job title:                       Principal Module Reliability engineer

Department:                Integration Technology Department

Location:                     Birmingham

Hours of work:             37 hours a week

Contract:                     Permanent

Salary:                          Competitive

Working hours:            Hours: 9:00 – 18:00 Mon -Thurs and 09:00 -15:00 on a Fri (1hour unpaid lunch).

Reference:                     3-5

The Role

This role will be responsible for power module reliability analysis and test of power electronics devices, components and assemblies. Establish a module product reliability analysis method and workflow.

Benefits

TEIC is a great place to work with opportunities for professional and personal development. Our benefits include:

  • 25 days holiday + 8 bank holidays
  • Holiday allowance increase with length of service
  • Bupa healthcare
  • Free on site car parking
  • Free lunch Monday to Friday
  • Contributory Pension
  • Life assurance
  • Cycle to work scheme
  • Company sick pay
  • Professional Membership fees paid e.g. CIPD, IEEE
  • Family Friendly policies
  • An Independent 24-hour confidential counseling service

Key responsibilities

  • Responsible for the planning and implementation of reliability research of power modules
  • Responsible for the optimization of power module reliability research system and the introduction of reliability methods and tools;
  • Responsible for understanding and confirming customer requirements for reliability of power modules and making evaluation plans
  • Establish and improve power module reliability test platform;
  • Define and improve power module reliability test standards and related manuals
  • Participate in the company's cutting-edge product reliability research, patent excavation and application
  • Research and development of new test methods for reliability concerns;
  • Study reliability failure mechanisms of new power device packaging
  • Responsible for reliability analysis and health monitoring of power modules such as IGBTs and SiC and GaN;
  • Establish life prediction and health monitoring systems for power modules;
  • Establish failure models for various failure criteria based on various tests (stress-strain, humidity, vibration) data;
  • Analysis of the failure mechanism of power modules to promote rectification and implementation;
  • Research and tracking of cutting edge technology in power semiconductor module reliability;
  • Assist in the development of departmental teams and newcomers training;

Core Skills and Education

  • Master or PhD Degree or equivalent in a  reliability, physics, materials, semiconductor ,and other related subjects;
  • The equivalent of a PhD with at least 2 years of experience, a Masters with at least 5 years of experience
  • At least 2 years of experience in power module reliability analysis
  • Solid background in DFR: ALT, HALT, Weibull analysis, reliability prediction, MTTF, life date analysis etc.
  • Proficient in the power modules reliability test, using reliability statistics to interpret test results
  • Proficient in the failure mechanism of power module reliability test
  • Familiar with power semiconductor device package structure and packaging process
  • Have a strong ability to solve problems scientifically and  systematically  (determine the root cause, promote improvement measures and completely solve the problem)

 

If you are interested in this oportunity please apply now.

Your CV will be forwarded to Jonathan Lee Recruitment, a leading engineering and manufacturing recruitment consultancy established in 1978. The services advertised by Jonathan Lee Recruitment are those of an Employment Agency.

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