Principal Module Reliability Engineer

  • Location


  • Sector:


  • Job type:


  • Salary:

    GBP50000 - GBP55000 per annum

  • Contact:

    Tim Parkes

  • Contact email:

  • Contact phone:

    01384 446145

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Job Description

Job title: Principal Module Reliability engineer
Department:  R&D Centre: Assemblies
Location:  Birmingham
Job Summary

Our client has been manufacturing semiconductor products for over 60 years; providing Power Module and Electric Vehicle System products to customers across the world. It is an exciting time to be joining this leading technology company as we are in a significant period of growth which is planned to continue with a major growth investment in the Birmingham area.

To support this growth plan, we are looking for a Principal Chip Design Engineer (IGBT & SiC) to join the R&D Centre. - This new centre will be situated in Birmingham. Successful candidates will be comfortable with travel to Lincoln in the first two months until the brand new and industry-leading design and development complex is up and running in Birmingham.

The Role
This role will be responsible for power module reliability analysis and test, Establish a module product reliability analysis method and work flow.

An excellent benefits package is offered to the right candidate.

Key Responsibilities

  • Responsible for the planning and implementation of reliability research of power modules
  • Responsible for the optimisation of power module reliability research system and the introduction of reliability methods and tools;
  • Responsible for understanding and confirming customer requirements for reliability of power modules and making evaluation plans
  • Establish and improve power module reliability test platform;
  • Define and improve power module reliability test standards and related manuals
  • Participate in the company's cutting-edge product reliability research, patent excavation and application
  • Research and development of new test methods for reliability concerns;
  • Study reliability failure mechanisms of new power device packaging
  • Responsible for reliability analysis and health monitoring of power modules such as IGBTs and SiC and GaN;
  • Establish life prediction and health monitoring systems for power modules;
  • Establish failure models for various failure criteria based on various tests (stress-strain, humidity, vibration) data;
  • Analysis of the failure mechanism of power modules to promote rectification and implementation;
  • Research and tracking of cutting edge technology in power semiconductor module reliability;
  • Assist in the development of departmental teams and newcomers training;


Core Skills and Education

  • Master or PhD Degree or equivalent in a reliability, physics, materials, semiconductor, and other related subjects;
  • The equivalent of a PhD with demonstrable experience in power module reliability analysis
  • Solid background in DFR: ALT, HALT, Weibull analysis, reliability prediction, MTTF, life date analysis etc.
  • Proficient in the power modules reliability test, using reliability statistics to interpret test results
  • Proficient in the failure mechanism of power module reliability test
  • Familiar with power semiconductor device package structure and packaging process

If you are interested in this exciting opportunity to join a growing organisation apply now.



Your CV will be forwarded to Jonathan Lee Recruitment, a leading engineering and manufacturing recruitment consultancy established in 1978. The services advertised by Jonathan Lee Recruitment are those of an Employment Agency.

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