Module Design Engineer

  • Location

    Birmingham, West Midlands

  • Sector:


  • Job type:


  • Salary:

    Up to £42000.00 per annum

  • Contact:

    Tim Parkes

  • Contact email:

  • Salary high:


  • Salary low:


  • Job ref:


  • Published:

    about 2 years ago

  • Duration:


  • Expiry date:


  • Startdate:


  • Consultant:


Job title: Principal Module Process Development Engineer

Department: R&D Centre: Assemblies

Location: Birmingham (Initially in Lincoln)

Hours of work: 37 hours a week

Contract: Permanent

Salary: Competitive

The Role

This role will be responsible power device packaging development, Conduct packaging structure design as well as analysis and calculation, define technical specifications for subunit, and manage deliverable results/reports.

Key Responsibilities

  • Responsible for power module development base on IGBT ,SiC as well as other power device,
  • Responsible for power module design, including 3D/2D drawing for assemblies and parts as well as the analysis and calculation during development.
  • Participate in parameter extraction of power modules, EMC/EMI research and packaging structure optimization design.
  • Participate in the research of IGBT power module characteristics and datasheet preparation
  • Continuously capture the power device packaging technology
  • Participate in the company's cutting-edge product technology research, patent excavation and application
  • Participate in productizing power device packaging technology following company product development
  • Responsible for requirement input of design, analysis, simulation, testing,define technical specifications ,reports and other documentation
  • Responsible for DEFMEA of power modules, formulate related documents according to APQP process
  • Follow-up, modification and acceptance of mould making
  • Define the specification and test standard of structural material
  • Structural sample testing, small batch trial production follow up and assessment
  • Responsible for drawing filing

Core Skills and Education

  • A degree in Electronic engineering, microelectronics, physics, materials and other related subjects;
  • At least 3 years of experience in R&D of power device packaging.
  • Solid background in electronic packaging technology, microelectronics and solid-state electronics, semiconductor physics, and materials science.
  • Familiar with packaging structure of power device, and packaging process;
  • Familiar with various common packaging materials;
  • Experience using 3D modelling software such as Solid Edge or other 3D design software
  • Familiar with the basic processing technology of plastic and hardware
  • Understand power module failure analysis;
  • Familiar with automotive APQP documentation (DFMEA, special feature list, etc.) is preferred

If you are interested in joining this exciting team, please send your CV . or call Tim Parkes on 01384 446145 now.

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